Login / Signup

Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging.

C. W. TanY. C. ChanH. P. ChanN. W. LeungC. K. So
Published in: Microelectron. Reliab. (2004)
Keyphrases
  • mechanical properties
  • composite materials
  • high speed
  • physical characteristics
  • human body
  • finite element model
  • high density
  • degrees of freedom
  • genetic algorithm
  • stainless steel
  • image segmentation