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nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads.
Asit Kumar Gain
Y. C. Chan
Winco K. C. Yung
Published in:
Microelectron. Reliab. (2011)
Keyphrases
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mechanical properties
electron microscopy
low energy
x ray
composite materials
finite element model
thin film
shear stress
search algorithm
databases
information retrieval
image processing
mathematical model
material properties