Login / Signup
D. Y. Luk
Publication Activity (10 Years)
Years Active: 2002-2002
Publications (10 Years): 0
</>
Publications
</>
Y. C. Chan
,
D. Y. Luk
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature.
Microelectron. Reliab.
42 (8) (2002)
Y. C. Chan
,
D. Y. Luk
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure.
Microelectron. Reliab.
42 (8) (2002)