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Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature.
Y. C. Chan
D. Y. Luk
Published in:
Microelectron. Reliab. (2002)
Keyphrases
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high speed
parameter values
anisotropic diffusion
real time
room temperature
low cost
parameter estimation
input output
weibull distribution
analog vlsi
input parameters
parameter space
sensitivity analysis
probabilistic model
multiscale
genetic algorithm
neural network