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Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure.
Y. C. Chan
D. Y. Luk
Published in:
Microelectron. Reliab. (2002)
Keyphrases
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weibull distribution
maximum likelihood
real time
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input output
parameter values
vlsi implementation
image processing
infrared
sensitivity analysis
parameter settings
printed circuit boards
programmable logic