Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages.
Asit Kumar GainY. C. ChanAhmed SharifN. B. WongWinco K. C. YungPublished in: Microelectron. Reliab. (2009)
Keyphrases
- mechanical properties
- electron microscopy
- nano scale
- grid computing
- composite materials
- grid points
- vision system
- x ray
- shear stress
- failure rate
- room temperature
- case study
- printed circuit boards
- programmable logic
- wire bonding
- table tennis
- grid services
- computational grids
- discrete space
- resource management
- mathematical model
- three dimensional