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High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material.
Asit Kumar Gain
Liangchi Zhang
Published in:
Microelectron. Reliab. (2018)
Keyphrases
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material properties
high temperature
finite element
finite element analysis
spatially varying
finite element model
motion analysis
soft tissue
loading conditions
mechanical properties
high speed
motion tracking
photometric stereo
neural network
magnetic resonance
sufficient conditions
image processing