Extreme wafer thinning optimization for via-last applications.
Anne JourdainJoeri De VosFumihiro InoueKenneth J. RebibisAndy MillerGerald BeyerEric BeyneEdward WalsbyJash PatelOliver AnsellJanet HopkinsHuma AshrafDave ThomasPublished in: 3DIC (2016)
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