High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer.
C. Roda NeveMikael DetallePhilip NolmansYunlong LiJoeri De VosGeert Van der PlasGerald BeyerEric BeynePublished in: 3DIC (2016)
Keyphrases
- high density
- metal oxide
- low density
- close proximity
- chemical vapor deposition
- high power
- x ray
- data center
- embedded systems
- thin film
- plasma etching
- solid state
- si sio
- magnetic recording
- high bandwidth
- power supply
- high speed
- magnetic tape
- databases
- transmission line
- field effect transistors
- high levels
- real time
- low cost
- state space