Login / Signup
Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges.
Joeri De Vos
Vladimir Cherman
Mikael Detalle
Teng Wang
Abdellah Salahouelhadj
Robert Daily
Geert Van der Plas
Eric Beyne
Published in:
3DIC (2014)
Keyphrases
</>
databases
comparative study
database systems
lessons learned
real world
real time
open issues
key issues
search engine
decision making
image sequences
scientific data analysis
efficient processing
integrated circuit
artificial neural networks
information systems
genetic algorithm
data sets