Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.
Y. YangRiet LabieF. LingC. ZhaoA. RadisicJan Van OlmenYoussef TravalyBert VerlindenIngrid De WolfPublished in: Microelectron. Reliab. (2010)
Keyphrases
- integrated circuit
- three dimensional
- printed circuit boards
- electron beam
- semiconductor devices
- real time
- assessment process
- metal oxide semiconductor
- high density
- data processing
- multi view
- image sequences
- thin film
- evaluation process
- high speed
- x ray
- quality assessment
- signal processing
- software development
- automatic assessment
- d objects