A. Radisic

Publication Activity (10 Years)

Years Active: 2010-2010
Publications (10 Years): 0

Publications

Y. Yang, Riet Labie, F. Ling, C. Zhao, A. Radisic, Jan Van Olmen, Youssef Travaly, Bert Verlinden, Ingrid De Wolf
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures. Microelectron. Reliab. 50 (9-11) (2010)