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Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact.
F. L. T. Maggioni
Herman Oprins
Eric Beyne
Ingrid De Wolf
Martine Baelmans
Published in:
Microelectron. J. (2014)
Keyphrases
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statistical analysis
computational model
high level
similarity measure
parameter estimation
theoretical framework
conceptual model
empirical data
image processing
high accuracy
error rate
infrared
mathematical model
statistical model
formal model