Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy.
M. HermsM. WagnerIngrid De WolfPublished in: Microelectron. Reliab. (2016)
Keyphrases
- infrared
- high density
- infrared images
- thin film
- image analysis
- multi sensor
- infrared imagery
- electro optical
- visible spectrum
- integrated circuit
- semiconductor devices
- target detection and tracking
- automatic target recognition
- hyperspectral
- high speed
- low cost
- thermal infrared
- infrared video
- infrared camera
- target detection
- computer vision
- multiresolution
- image processing
- real time