Takafumi Fukushima

Publication Activity (10 Years)

Years Active: 2005-2023
Publications (10 Years): 29

Top Topics

Defect Prediction

Artificial Vision

Highly Accurate

Top Venues

Publications

Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction. BioCAS (2023)
Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. 3DIC (2023)
Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. 3DIC (2023)
Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip. BioCAS (2022)
Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration. IEICE Electron. Express 19 (23) (2022)
Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System. BioCAS (2021)
Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. 3DIC (2021)
Takafumi Fukushima
Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE. VLSI Circuits (2021)
Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. 3DIC (2021)
Koji Kiyoyama, Yoshihiko Horio, Takafumi Fukushima, Hiroyuki Hashimoto, Takemori Orima, Mitsumasa Koyanagi
Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing. 3DIC (2021)
Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima
Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. 3DIC (2019)
Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation. 3DIC (2019)
Ryosuke Yabuki, Tetsu Tanaka, Zhengyang Qian, Kar Mun Lee, Bang Du, Filipe Alves Satake, Tasuku Fukushima, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama
PPG and SpO2 Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System. BioCAS (2019)
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System. 3DIC (2019)
Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing. 3DIC (2019)
Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima
Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI. 3DIC (2019)
Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. 3DIC (2019)
Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takafumi Fukushima
Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration. 3DIC (2019)
Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Development of 3D-IC Embedded Flexible Hybrid System. 3DIC (2019)
Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, Hiroyuki Hashimoto, Mitsu Koyanagi
Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal. IRPS (2018)
Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka
Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips. BioCAS (2018)
Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current. BioCAS (2017)
Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino, Takafumi Fukushima, Kouji Kiyoyama, Tetsu Tanaka
Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip. BioCAS (2017)
Kang Wook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi
Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications. 3DIC (2016)
Mariappan Murugesan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi
Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology. 3DIC (2016)
Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines 7 (10) (2016)
Takafumi Fukushima, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
New concept of TSV formation methodology using Directed Self-Assembly (DSA). 3DIC (2016)
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka
Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler. 3DIC (2016)
Yasutaka Kamei, Takafumi Fukushima, Shane McIntosh, Kazuhiro Yamashita, Naoyasu Ubayashi, Ahmed E. Hassan
Studying just-in-time defect prediction using cross-project models. Empir. Softw. Eng. 21 (5) (2016)
Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka
Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. 3DIC (2015)
Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM. IRPS (2015)
Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. 3DIC (2015)
Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi
Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. 3DIC (2015)
Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors. 3DIC (2015)
K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. 3DIC (2015)
Yangyang Yan, Yingtao Ding, Qianwen Chen, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications. 3DIC (2015)
K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka
Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University. 3DIC (2015)
K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC (2014)
Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka
Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. 3DIC (2014)
Takafumi Fukushima, Yasutaka Kamei, Shane McIntosh, Kazuhiro Yamashita, Naoyasu Ubayashi
An empirical study of just-in-time defect prediction using cross-project models. MSR (2014)
Takafumi Fukushima, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi
Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. 3DIC (2014)
Kouji Kiyoyama, Y. Sato, Hiroyuki Hashimoto, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor. 3DIC (2013)
Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Ho-Young Son, M.-S. Suh, K.-Y. Byun, N.-S. Kim, Kang Wook Lee, Mitsumasa Koyanagi
3D memory chip stacking by multi-layer self-assembly technology. 3DIC (2013)
Kang Wook Lee, Seiya Tanikawa, Mariappan Murugesan, H. Naganuma, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory. 3DIC (2013)
Mariappan Murugesan, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi, Yuji Sutou, H. Wang, J. Koike
Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV. 3DIC (2013)
Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Mitsumasa Koyanagi
Development of via-last 3D integration technologies using a new temporary adhesive system. 3DIC (2013)
Hiroyuki Hashimoto, Takafumi Fukushima, Kang Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka
Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system. 3DIC (2013)
Takafumi Fukushima, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Temporary bonding strength control for self-assembly-based 3D integration. 3DIC (2011)
Mariappan Murugesan, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
High density Cu-TSVs and reliability issues. 3DIC (2011)
Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, H. Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi
A very low area ADC for 3-D stacked CMOS image processing system. 3DIC (2011)
Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI. 3DIC (2011)
Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress. 3DIC (2011)
Makoto Motoyoshi, Junichi Takanohashi, Takafumi Fukushima, Yasuo Arai, Mitsumasa Koyanagi
Stacked SOI pixel detector using versatile fine pitch μ-bump technology. 3DIC (2011)
Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi
Chip-level TSV integration for rapid prototyping of 3D system LSIs. 3DIC (2011)
Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines 2 (1) (2011)
Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Yuki Ohara, Tetsu Tanaka, Mitsumasa Koyanagi
High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs. 3DIC (2011)
Yuka Ito, Shinsuke Terada, Shinya Arai, Koji Choki, Takafumi Fukushima, Mitsumasa Koyanagi
High-bandwidth data transmission of new transceiver module through optical interconnection. 3DIC (2011)
Yuki Ohara, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. 3DIC (2011)
Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI. 3DIC (2010)
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding. CICC (2010)
Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, Hiroaki Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi
A block-parallel signal processing system for CMOS image sensor with three-dimensional structure. 3DIC (2010)
Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. 3DIC (2010)
Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding. 3DIC (2010)
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
Three-dimensional integration technology and integrated systems. ASP-DAC (2009)
Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi
Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch. 3DIC (2009)
Kouji Kiyoyama, Yuki Ohara, Kang Wook Lee, Y. Yang, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
A parallel ADC for high-speed CMOS image processing system with 3D structure. 3DIC (2009)
Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Heterogeneous integration technology for MEMS-LSI multi-chip module. 3DIC (2009)
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka
High-Density Through Silicon Vias for 3-D LSIs. Proc. IEEE 97 (1) (2009)
Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC (2009)
Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC (2009)
Takeaki Sugimura, Yuta Konishi, Yoshihiro Nakatani, Takafumi Fukushima, Hiroyuki Kurino, Mitsumasa Koyanagi
Dynamic Multi-Context Reconfiguration Scheme for Reconfigurable Parallel Image Processing System with Three Dimensional Structure. ARCS Workshops (2005)