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High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs.
Kang Wook Lee
Jichoel Bea
Takafumi Fukushima
Yuki Ohara
Tetsu Tanaka
Mitsumasa Koyanagi
Published in:
3DIC (2011)
Keyphrases
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high reliability
high end
low cost
high precision
low end
computer systems
mobile devices
computing systems
frame rate
real time
high quality
computational complexity
file system