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Yuki Ohara
Publication Activity (10 Years)
Years Active: 2009-2011
Publications (10 Years): 0
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Publications
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Takafumi Fukushima
,
Yuki Ohara
,
Jichoel Bea
,
Mariappan Murugesan
,
Kang Wook Lee
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
Temporary bonding strength control for self-assembly-based 3D integration.
3DIC
(2011)
Kang Wook Lee
,
Jichoel Bea
,
Takafumi Fukushima
,
Yuki Ohara
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs.
3DIC
(2011)
Yuki Ohara
,
Kang Wook Lee
,
Takafumi Fukushima
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration.
3DIC
(2011)
Mariappan Murugesan
,
Yuki Ohara
,
Jichoel Bea
,
Kang Wook Lee
,
Takafumi Fukushima
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding.
3DIC
(2010)
Kouji Kiyoyama
,
Yuki Ohara
,
Kang Wook Lee
,
Y. Yang
,
Takafumi Fukushima
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
A parallel ADC for high-speed CMOS image processing system with 3D structure.
3DIC
(2009)
Kang Wook Lee
,
Shigeyuki Kanno
,
Yuki Ohara
,
Kouji Kiyoyama
,
Ji Chel Bea
,
Takafumi Fukushima
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
Heterogeneous integration technology for MEMS-LSI multi-chip module.
3DIC
(2009)
Yoshiyuki Kaiho
,
Yuki Ohara
,
Hirotaka Takeshita
,
Kouji Kiyoyama
,
Kang Wook Lee
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
3D integration technology for 3D stacked retinal chip.
3DIC
(2009)
Yuki Ohara
,
Akihiro Noriki
,
Katsuyuki Sakuma
,
Kang Wook Lee
,
Mariappan Murugesan
,
Jichoel Bea
,
Fumiaki Yamada
,
Takafumi Fukushima
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.
3DIC
(2009)
Ji Chel Bea
,
Mariappan Murugesan
,
Yuki Ohara
,
Akihiro Noriki
,
Hisashi Kino
,
Kang Wook Lee
,
Takafumi Fukushima
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration.
3DIC
(2009)