Akihiro Noriki

Publication Activity (10 Years)

Years Active: 2009-2021
Publications (10 Years): 4

Top Topics

Top Venues

Publications

Takeru Amano, Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Takayuki Kurosu, Koichi Takemura, Tsuyoshi Aoki, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi
Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate. OFC (2021)
Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Koichi Takemura, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano
Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors. ECOC (2020)
Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Akihiro Noriki, Takeru Amano, Daisuke Okamoto, Yasuyuki Suzuki, Kazuhiko Kurata
Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers. 3DIC (2019)
Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano
Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror. 3DIC (2019)
Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI. 3DIC (2011)
Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI. 3DIC (2010)
Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC (2009)
Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC (2009)