Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers.
Koichi TakemuraAkio UkitaYasuhiro IbusukiMitsuru KuriharaAkihiro NorikiTakeru AmanoDaisuke OkamotoYasuyuki SuzukiKazuhiko KurataPublished in: 3DIC (2019)