Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.
Akihiro NorikiKang Wook LeeJichoel BeaTakafumi FukushimaTetsu TanakaMitsumasa KoyanagiPublished in: 3DIC (2010)
Keyphrases
- data transmission
- high speed
- data acquisition
- metal oxide
- si sio
- low power
- real time
- wireless sensor networks
- data transfer
- latent semantic indexing
- computer networks
- communication networks
- signal acquisition
- base station
- multi hop
- frame rate
- energy consumption
- data delivery
- databases
- routing protocol
- transmission delay
- solar cell
- low cost
- distributed databases
- information sources
- monitoring system
- error detection and correction
- database systems
- smart card