Ji Chel Bea

Publication Activity (10 Years)

Years Active: 2009-2019
Publications (10 Years): 3

Top Topics

Web Environment

Top Venues

Publications

Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima
Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. 3DIC (2019)
Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, Hiroyuki Hashimoto, Mitsu Koyanagi
Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal. IRPS (2018)
Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines 7 (10) (2016)
Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM. IRPS (2015)
K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. 3DIC (2015)
K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka
Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University. 3DIC (2015)
K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC (2014)
Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka
Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. 3DIC (2014)
Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines 2 (1) (2011)
Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Heterogeneous integration technology for MEMS-LSI multi-chip module. 3DIC (2009)
Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC (2009)