Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.
K. W. LeeChisato NagaiAi NakamuraJi Chel BeaMariappan MurugesanTakafumi FukushimaTanaka TanakaMitsumasa KoyanagiPublished in: 3DIC (2014)
Keyphrases
- low cost
- high reliability
- multi layer
- single layer
- multiple layers
- cost effective
- inter layer
- digital camera
- lower layers
- wide range
- middle layer
- low power consumption
- low power
- highly efficient
- application layer
- highly accurate
- single chip
- learning algorithm
- embedded systems
- data acquisition
- high precision
- website
- image processing