Ai Nakamura

Publication Activity (10 Years)

Years Active: 2014-2022
Publications (10 Years): 5

Top Topics

Mechanical Properties

Magnetic Recording

Top Venues

Cogn. Syst. Res.

Publications

Ai Nakamura, Shota Ishigaki, Yoshifumi Morita, Hirofumi Tanabe
Relationship between Metacarpophalangeal Joint Angle and Muscle Activity of Healthy Persons while Using the Finger Extensor Facilitation Training Device "iPARKO". ICORR (2022)
Hugo Gonçalo Oliveira, Tiago Mendes, Ana Boavida, Ai Nakamura, Margareta Ackerman
Co-PoeTryMe: Interactive poetry generation. Cogn. Syst. Res. 54 (2019)
Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takafumi Fukushima
Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration. 3DIC (2019)
Kang Wook Lee, Ai Nakamura, Jicheol Bea, Takafumi Fukushima, Suresh Ramalingam, Xin Wu, Tanaka Tanaka, Mitsumasa Koyanagi
Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications. 3DIC (2016)
K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. 3DIC (2015)
K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC (2014)