Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications.
Kang Wook LeeAi NakamuraJicheol BeaTakafumi FukushimaSuresh RamalingamXin WuTanaka TanakaMitsumasa KoyanagiPublished in: 3DIC (2016)