Login / Signup
Jicheol Bea
Publication Activity (10 Years)
Years Active: 2014-2016
Publications (10 Years): 1
Top Topics
Nano Scale
High Density
Vlsi Implementation
Modular Design
Top Venues
3DIC
</>
Publications
</>
Kang Wook Lee
,
Ai Nakamura
,
Jicheol Bea
,
Takafumi Fukushima
,
Suresh Ramalingam
,
Xin Wu
,
Tanaka Tanaka
,
Mitsumasa Koyanagi
Nano-scale Cu direct bonding using ultra-high density Cu nano-pillar (CNP) for high yield exascale 2.5/3D integration applications.
3DIC
(2016)
Takafumi Fukushima
,
Yuka Ito
,
Mariappan Murugesan
,
Jicheol Bea
,
Kang Wook Lee
,
Koji Choki
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration.
3DIC
(2014)