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Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration.
Takafumi Fukushima
Yuka Ito
Mariappan Murugesan
Jicheol Bea
Kang Wook Lee
Koji Choki
Tetsu Tanaka
Mitsumasa Koyanagi
Published in:
3DIC (2014)
Keyphrases
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high speed
low cost
analog vlsi
modular design
high density
physical design
vlsi implementation
evolvable hardware
circuit design
single chip
host computer
data fusion
functional verification
web services
chip design