Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers.
K. W. LeeChisato NagaiAi NakamuraHiroki AizawaJi Chel BeaMitsumasa KoyanagiHideto HashiguchiTakafumi FukushimaTanaka TanakaPublished in: 3DIC (2015)
Keyphrases
- field effect transistors
- high density
- low density
- electron microscopy
- thin film
- close proximity
- magnetic recording
- steady state
- high power
- high speed
- data center
- mathematical analysis
- integrated circuit
- software package
- massively parallel
- grain size
- magnetic tape
- data processing
- metal oxide
- neural network
- multi layer
- data integration
- computer simulation
- data analysis
- data streams