K. W. Lee

Publication Activity (10 Years)

Years Active: 1987-2023
Publications (10 Years): 5

Top Topics

Magnetic Recording

Top Venues

Publications

S. Lee, N.-H. Lee, K. W. Lee, J. H. Kim, J. H. Jin, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae
Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC. IRPS (2023)
N.-H. Lee, S. Lee, S.-H. Kim, G.-J. Kim, K. W. Lee, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae
Transistor Reliability Characterization for Advanced DRAM with HK+MG & EUV process technology. IRPS (2022)
Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka
Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. 3DIC (2015)
K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. 3DIC (2015)
K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka
Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University. 3DIC (2015)
K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC (2014)
Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka
Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. 3DIC (2014)
Bharath Kalyan, K. W. Lee, W. Sardha Wijesoma, D. Moratuwage, Nicholas M. Patrikalakis
A random finite set based detection and tracking using 3D LIDAR in dynamic environments. SMC (2010)
Bharath Kalyan, K. W. Lee, W. Sardha Wijesoma
FISST-SLAM: Finite Set Statistical Approach to Simultaneous Localization and Mapping. Int. J. Robotics Res. 29 (10) (2010)
K. S. Park, K. W. Lee, M. S. Park, D. Kim
Joint use of DEA and constrained canonical correlation analysis for efficiency valuations involving categorical variables. J. Oper. Res. Soc. 60 (12) (2009)
Javier Ibañez-Guzmán, W. Sardha Wijesoma, K. W. Lee
Roadmap constrained SLAM in neighborhood environment. ICARCV (2004)
K. W. Lee
Stochastic models for random-request availability. IEEE Trans. Reliab. 49 (1) (2000)
K. W. Lee, H. N. Lam
Optimal Sizing of Feedforward Neural Networks: Case Studies. ANNES (1995)
K. W. Lee, H. N. Lam
Optimising neural network weights using genetic algorithms: a case study. ICNN (1995)
W. Yu, S. Y. Kang, K. W. Lee
TDX-1: A Distributed System Architecture for High Throughout Telephone Switching. COMPCON (1987)