S. Pae

Publication Activity (10 Years)

Years Active: 2022-2024
Publications (10 Years): 6

Top Topics

Top Venues

Publications

Sunhang Lee, Nam-Hyun Lee, G.-J. Kim, J. Ahn, Ik-Hwan Kim, S. Ha, S. Rhee, GH Bae, KW Lee, YS Lee, SB. Ko, S. Pae
Effect of Off-State Stress on Data-Valid Window Margin for Advanced DRAM Using HK/MG Process Technology. IRPS (2024)
Jinsoo Bae, H. G. Noh, S. J. Yoo, I. J. Choi, G. H. Bae, Y. M. Shim, S. G. Lee, H. Jang, S. M. Lee, G. H. Chang, K. S. Kwon, C. B. Yoon, S. Y. Lee, J. W. Pyun, H. J. Kim, S. B. Ko, Y. C. Hwang, S. Pae
Thermo-Mechanical Reliability Characteristics of 8H HBM3. IRPS (2024)
Sungmock Ha, S. Lee, G. H. Bae, D. S. Lee, S. H. Kim, B. W. Woo, N.-H. Lee, Y. S. Lee, S. Pae
Reliability Characterization of HBM featuring $\text{HK}+\text{MG}$ Logic Chip with Multi-stacked DRAMs. IRPS (2023)
J. H. Lee, B. W. Woo, Y. M. Lee, N. H. Lee, S. H. Lee, Y. S. Lee, H. S. Kim, S. Pae
Reliability Improvement with Optimized BEOL Process in Advanced DRAM. IRPS (2023)
S. Lee, N.-H. Lee, K. W. Lee, J. H. Kim, J. H. Jin, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae
Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC. IRPS (2023)
N.-H. Lee, S. Lee, S.-H. Kim, G.-J. Kim, K. W. Lee, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae
Transistor Reliability Characterization for Advanced DRAM with HK+MG & EUV process technology. IRPS (2022)