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Reliability Characterization of HBM featuring $\text{HK}+\text{MG}$ Logic Chip with Multi-stacked DRAMs.

Sungmock HaS. LeeG. H. BaeD. S. LeeS. H. KimB. W. WooN.-H. LeeY. S. LeeS. Pae
Published in: IRPS (2023)
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