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Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.
Mariappan Murugesan
Takafumi Fukushima
Ji Chel Bea
K. W. Lee
Mitsu Koyanagi
Y. Imai
S. Kimura
Tetsu Tanaka
Published in:
3DIC (2014)
Keyphrases
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high density
mechanical properties
low density
latent semantic indexing
close proximity
thin film
high power
data center
electron microscopy
magnetic tape
mechanical design
magnetic recording
coarse to fine
vector space
high bandwidth
text retrieval
databases
database