Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration.

Shunji Kurooka Yoshinori Hotta Ai Nakamura Mitsumasa Koyanagi Takafumi Fukushima

Published in: 3DIC (2019)

Keyphrases

electron microscopy
mechanical properties
key issues
computer vision
real world
lessons learned
knowledge base
data analysis
evolutionary algorithm
experimental data
technical challenges
technical solutions