Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration.
Takafumi FukushimaTakayuki KonnoEiji IwataRisato KobayashiToshiya KojimaMariappan MurugesanJi Chel BeaKang Wook LeeTetsu TanakaMitsumasa KoyanagiPublished in: Micromachines (2011)