Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.
Takafumi FukushimaHideto HashiguchiHiroshi YonekuraHisashi KinoMariappan MurugesanJi Chel BeaKang Wook LeeTetsu TanakaMitsumasa KoyanagiPublished in: Micromachines (2016)