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Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal.
Mariappan Murugesan
Takafumi Fukushima
Ji Chel Bea
Hiroyuki Hashimoto
Mitsu Koyanagi
Published in:
IRPS (2018)
Keyphrases
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high density
low cost
high speed
printed circuit boards
chip design
transmission line
electro mechanical
analog vlsi
programmable logic
multithreading
engineering and computer science
distribution networks
physical characteristics
vlsi implementation
real time
physical design
neural network