10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.
Yuki OharaAkihiro NorikiKatsuyuki SakumaKang Wook LeeMariappan MurugesanJichoel BeaFumiaki YamadaTakafumi FukushimaTetsu TanakaMitsumasa KoyanagiPublished in: 3DIC (2009)
Keyphrases
- low cost
- high speed
- coarse to fine
- analog vlsi
- vlsi implementation
- high density
- mechanical properties
- single chip
- host computer
- programmable logic
- physical design
- electron microscopy
- evolvable hardware
- electro mechanical systems
- real time
- functional verification
- vlsi design
- power dissipation
- signal processing
- knowledge base
- data sets