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Fumiaki Yamada
Publication Activity (10 Years)
Years Active: 2009-2016
Publications (10 Years): 1
Top Topics
Programmable Logic
High Density
Ride Comfort
Subjective Evaluation
Top Venues
3DIC
AMC
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Publications
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Fumiaki Yamada
,
Kohei Suzuki
,
Tatsuo Toda
,
Gan Chen
,
Isao Takami
Robust control of active suspension to improve ride comfort with structural constraints.
AMC
(2016)
Sayuri Kohara
,
Akihiro Horibe
,
Kuniaki Sueoka
,
Keiji Matsumoto
,
Fumiaki Yamada
,
Hiroyuki Mori
,
Yasumitsu Orii
Thermo-mechanical evaluation of 3D packages.
3DIC
(2013)
Keiji Matsumoto
,
Soichiro Ibaraki
,
Kuniaki Sueoka
,
Katsuyuki Sakuma
,
Hidekazu Kikuchi
,
Hiroyuki Mori
,
Yasumitsu Orii
,
Fumiaki Yamada
,
Kohei Fujihara
,
Junichi Takamatsu
,
Koji Kondo
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack.
3DIC
(2013)
Toru Ikeda
,
Masatoshi Oka
,
Shinya Kawahara
,
Noriyuki Miyazaki
,
Keiji Matsumoto
,
Sayuri Kohara
,
Yasumitsu Orii
,
Fumiaki Yamada
,
Morihiro Kada
Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package.
3DIC
(2011)
Sayuri Kohara
,
Akihiro Horibe
,
Kuniaki Sueoka
,
Keiji Matsumoto
,
Fumiaki Yamada
,
Yasumitsu Orii
,
Katsuyuki Sakuma
,
Takahiro Kinoshita
,
Takashi Kawakami
Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration.
3DIC
(2011)
Akihiro Horibe
,
Kuniaki Sueoka
,
Katsuyuki Sakuma
,
Sayuri Kohara
,
Keiji Matsumoto
,
Hidekazu Kikuchi
,
Yasumitsu Orii
,
Toshiro Mitsuhashi
,
Fumiaki Yamada
High density 3D integration by pre-applied Inter Chip Fill.
3DIC
(2010)
Keiji Matsumoto
,
Soichiro Ibaraki
,
Katsuyuki Sakuma
,
Fumiaki Yamada
Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack.
3DIC
(2009)
Akihiro Horibe
,
Fumiaki Yamada
Advanced 3D chip stack process for thin dies with fine pitch bumps using pre-applied inter chip fill.
3DIC
(2009)
Yuki Ohara
,
Akihiro Noriki
,
Katsuyuki Sakuma
,
Kang Wook Lee
,
Mariappan Murugesan
,
Jichoel Bea
,
Fumiaki Yamada
,
Takafumi Fukushima
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.
3DIC
(2009)