Fumiaki Yamada

Publication Activity (10 Years)

Years Active: 2009-2016
Publications (10 Years): 1

Top Topics

Programmable Logic

Subjective Evaluation

Top Venues

Publications

Fumiaki Yamada, Kohei Suzuki, Tatsuo Toda, Gan Chen, Isao Takami
Robust control of active suspension to improve ride comfort with structural constraints. AMC (2016)
Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Hiroyuki Mori, Yasumitsu Orii
Thermo-mechanical evaluation of 3D packages. 3DIC (2013)
Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, Koji Kondo
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack. 3DIC (2013)
Toru Ikeda, Masatoshi Oka, Shinya Kawahara, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package. 3DIC (2011)
Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii, Katsuyuki Sakuma, Takahiro Kinoshita, Takashi Kawakami
Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration. 3DIC (2011)
Akihiro Horibe, Kuniaki Sueoka, Katsuyuki Sakuma, Sayuri Kohara, Keiji Matsumoto, Hidekazu Kikuchi, Yasumitsu Orii, Toshiro Mitsuhashi, Fumiaki Yamada
High density 3D integration by pre-applied Inter Chip Fill. 3DIC (2010)
Keiji Matsumoto, Soichiro Ibaraki, Katsuyuki Sakuma, Fumiaki Yamada
Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack. 3DIC (2009)
Akihiro Horibe, Fumiaki Yamada
Advanced 3D chip stack process for thin dies with fine pitch bumps using pre-applied inter chip fill. 3DIC (2009)
Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC (2009)