Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack.
Keiji MatsumotoSoichiro IbarakiKuniaki SueokaKatsuyuki SakumaHidekazu KikuchiHiroyuki MoriYasumitsu OriiFumiaki YamadaKohei FujiharaJunichi TakamatsuKoji KondoPublished in: 3DIC (2013)