Kuniaki Sueoka

Publication Activity (10 Years)

Years Active: 2010-2015
Publications (10 Years): 1

Top Topics

Information Integration

Programmable Logic

Design Solutions

Top Venues

Publications

Kuniaki Sueoka, Akihiro Horibe, T. Aoki, Sayuri Kohara, Kazushige Toriyama, Hiroyuki Mori, Yasumitsu Orii
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration. 3DIC (2015)
Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Hiroyuki Mori, Yasumitsu Orii
Thermo-mechanical evaluation of 3D packages. 3DIC (2013)
Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, Koji Kondo
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack. 3DIC (2013)
Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii, Katsuyuki Sakuma, Takahiro Kinoshita, Takashi Kawakami
Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration. 3DIC (2011)
Akihiro Horibe, Kuniaki Sueoka, Katsuyuki Sakuma, Sayuri Kohara, Keiji Matsumoto, Hidekazu Kikuchi, Yasumitsu Orii, Toshiro Mitsuhashi, Fumiaki Yamada
High density 3D integration by pre-applied Inter Chip Fill. 3DIC (2010)