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High density 3D integration by pre-applied Inter Chip Fill.

Akihiro HoribeKuniaki SueokaKatsuyuki SakumaSayuri KoharaKeiji MatsumotoHidekazu KikuchiYasumitsu OriiToshiro MitsuhashiFumiaki Yamada
Published in: 3DIC (2010)
Keyphrases
  • high density
  • low density
  • high power
  • magnetic recording
  • data center
  • high bandwidth
  • thin film
  • low cost
  • close proximity
  • data sets
  • neural network
  • database systems
  • high speed
  • magnetic tape