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High density 3D integration by pre-applied Inter Chip Fill.
Akihiro Horibe
Kuniaki Sueoka
Katsuyuki Sakuma
Sayuri Kohara
Keiji Matsumoto
Hidekazu Kikuchi
Yasumitsu Orii
Toshiro Mitsuhashi
Fumiaki Yamada
Published in:
3DIC (2010)
Keyphrases
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high density
low density
high power
magnetic recording
data center
high bandwidth
thin film
low cost
close proximity
data sets
neural network
database systems
high speed
magnetic tape