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Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration.

Sayuri KoharaAkihiro HoribeKuniaki SueokaKeiji MatsumotoFumiaki YamadaYasumitsu OriiKatsuyuki SakumaTakahiro KinoshitaTakashi Kawakami
Published in: 3DIC (2011)
Keyphrases
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