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Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration.

Kuniaki SueokaAkihiro HoribeT. AokiSayuri KoharaKazushige ToriyamaHiroyuki MoriYasumitsu Orii
Published in: 3DIC (2015)
Keyphrases
  • low cost
  • data integration
  • high speed
  • process model
  • high density
  • metadata
  • case study
  • data fusion
  • digital camera
  • information integration