Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack.
Keiji MatsumotoSoichiro IbarakiKatsuyuki SakumaFumiaki YamadaPublished in: 3DIC (2009)
Keyphrases
- three dimensional
- high density
- high speed
- physical models
- infrared
- analog vlsi
- low cost
- multi view
- x ray
- printed circuit boards
- neural network
- measured data
- physical design
- image sequences
- depth map
- finite element analysis
- single chip
- human body
- measurement noise
- d objects
- vlsi design
- visible spectrum
- room temperature
- programmable logic
- surface temperature