Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate.
Takeru AmanoAkihiro NorikiIsao TamaiYasuhiro IbusukiAkio UkitaSatoshi SudaTakayuki KurosuKoichi TakemuraTsuyoshi AokiDaisuke ShimuraYosuke OnawaHiroki YaegashiPublished in: OFC (2021)