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Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding.
Mariappan Murugesan
Yuki Ohara
Jichoel Bea
Kang Wook Lee
Takafumi Fukushima
Tetsu Tanaka
Mitsumasa Koyanagi
Published in:
3DIC (2010)
Keyphrases
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high impact
factors that influence
machine learning
integrated circuit
semiconductor manufacturing
real time
artificial intelligence
database systems
digital libraries
feature space
information technology
massively parallel