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Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration.
Yuki Ohara
Kang Wook Lee
Takafumi Fukushima
Tetsu Tanaka
Mitsumasa Koyanagi
Published in:
3DIC (2011)
Keyphrases
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control charts
real time
human errors
process control
levels of abstraction
control system
three dimensional
neural network
database
low cost
web services
genetic algorithm
multi view
data integration
infrared
control method
databases
data sets
surface points