Yingtao Ding

Publication Activity (10 Years)

Years Active: 2011-2022
Publications (10 Years): 20

Top Topics

Top Venues

IEEE Signal Process. Lett.

Publications

Zhe Peng, Yingtao Ding, Shiwei Ren, Weijiang Wang, Wei Gu
Supplementary coprime array with enhanced DOFs exploiting hole filling strategy based on the difference and sum coarray. Digit. Signal Process. 121 (2022)
Shiyan Sun, An'an Li, Yingtao Ding, Zipeng Chen, Wei Wang, Sijia Jiang, Zhiming Chen, Baoyong Chi
A Ka-band calibratable phased-array front-end chip with high element-consistency. Sci. China Inf. Sci. 65 (12) (2022)
Zhe Peng, Yingtao Ding, Shiwei Ren, Haixia Wu, Weijiang Wang
Coprime Nested Arrays for DOA Estimation: Exploiting the Nesting Property of Coprime Array. IEEE Signal Process. Lett. 29 (2022)
Yilin Sun, Zhifang Liu, Yingtao Ding
Paper-based flexible broadband photodetectors functionalized by PbS quantum dots/Carbon nanotube networks hybrid structure. ICTA (2021)
Ziyue Zhang, Yingtao Ding, Baoyan Yang, Anrun Ren, Zhiming Chen
A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-Via. 3DIC (2021)
Zhe Peng, Yingtao Ding, Shiwei Ren, Xiaohua Wang
Extended Transformed Nested Arrays for DOA Estimation of Non-Circular Sources. IEEE Access 8 (2020)
An'an Li, Min Lin, Baoyong Chi, Yingtao Ding, Zheng Song, Zipeng Chen, Shiyan Sun, Yutian Li, Yinghang Wu, Zhenwu Wang, Zhiming Chen
A Fully Integrated K-Band Dual Down-Conversion Receiver for Radar Applications in 90 nm CMOS. IEEE Access 8 (2020)
Zhiqiang Cheng, Yingtao Ding, Ziyue Zhang, Mingrui Zhou, Zhiming Chen
Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling. IEEE Access 8 (2020)
An'an Li, Yingtao Ding, Zhiming Chen, Baoyong Chi
1.15 GHz image rejection filter with 45 dB image rejection ratio and 8.4 mW DC power in 90 nm CMOS. Microelectron. J. 84 (2019)
Jiatong Wang, Yingtao Ding, Shiwei Ren, Weijiang Wang
Sampling and Reconstruction of Multiband Signals in Multiresolution Subspaces Associated With the Fractional Wavelet Transform. IEEE Signal Process. Lett. 26 (1) (2019)
An'an Li, Yingtao Ding, Zipeng Chen, Wei Wang, Sijia Jiang, Shiyan Sun, Zhiming Chen, Baoyong Chi
A Fully Integrated 27.5-30.5 GHz 8-Element Phased-Array Transmit Front-end Module in 65 nm CMOS. A-SSCC (2019)
An'an Li, Yingtao Ding, Zhiming Chen, Baoyong Chi
A 25-35 GHz 5-bit digital attenuator with low RMS amplitude error and low phase variation in 65 nm CMOS. IEICE Electron. Express 16 (15) (2019)
Ziyue Zhang, Yingtao Ding, Zhiming Chen, Mingrui Zhou, Lei Xiao, Ziru Cai, Miao Xiong, Xiao Gong
Design and Evaluation of a Novel and Ultra-Compact Fully-TGV-based Self-Shielding Bandpass Filter for 5G Applications. 3DIC (2019)
Zhenhong Chen, Yingtao Ding, Shiwei Ren, Zhiming Chen
A Novel Nested Configuration Based on the Difference and Sum Co-Array Concept. Sensors 18 (9) (2018)
Zhenhong Chen, Yingtao Ding, Shiwei Ren, Zhiming Chen
A Novel Noncircular MUSIC Algorithm Based on the Concept of the Difference and Sum Coarray. Sensors 18 (2) (2018)
Shan Cao, Zoran Salcic, Yingtao Ding, Zhaolin Li, Shaojun Wei, Xianli Zhao
Temperature-aware task scheduling heuristics on Network-on-Chips. ISCAS (2016)
Shan Cao, Zoran Salcic, Zhaolin Li, Shaojun Wei, Yingtao Ding
Temperature-aware multi-application mapping on network-on-chip based many-core systems. Microprocess. Microsystems 46 (2016)
Yangyang Yan, Ziyue Zhang, Zhiqiang Cheng, Lingfeng Zhou, Zhiming Chen, Yingtao Ding
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias. 3DIC (2016)
Weijiang Wang, Yingtao Ding, Shan Cao, Xianli Zhao
Design of a dynamically reconfigurable arithmetic unit for matrix algorithms. ASICON (2015)
Yangyang Yan, Yingtao Ding, Qianwen Chen, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications. 3DIC (2015)
Weijiang Wang, Shiwei Ren, Yingtao Ding, Haoyu Wang
An Efficient Algorithm for Direction Finding against Unknown Mutual Coupling. Sensors 14 (11) (2014)
Yingtao Ding, Yangyang Yan, Qianwen Chen, Shiwei Wang, Rui Su, Hua Dang
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner. Microelectron. Reliab. 54 (6-7) (2014)
Xiujie Qu, He Chen, Yubin Zhang, Yingtao Ding
Design of DDS based on Hybird-CORDIC Architecture. Int. J. Comput. Intell. Syst. 4 (3) (2011)