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Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.
Yangyang Yan
Ziyue Zhang
Zhiqiang Cheng
Lingfeng Zhou
Zhiming Chen
Yingtao Ding
Published in:
3DIC (2016)
Keyphrases
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low cost
high density
low power
cost effective
integrated circuit
digital camera
transmission line
manufacturing process
highly efficient
electron microscopy
low energy
tool wear
ultra high
data acquisition
data center