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Yangyang Yan
ORCID
Publication Activity (10 Years)
Years Active: 2014-2022
Publications (10 Years): 6
Top Topics
Electron Microscopy
Neural Network
Multiscale
Gate Dielectrics
Top Venues
3DIC
IEEE ACM Trans. Comput. Biol. Bioinform.
Remote. Sens.
IEICE Electron. Express
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Publications
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Yangyang Yan
,
Hui Lei
,
Yihong Chen
,
Bin Zhou
Analyzing the Dynamic Spatiotemporal Changes in Urban Extension across Zhejiang Province Using NPP-VIIRS Nighttime Light Data.
Remote. Sens.
14 (13) (2022)
Guoxian Yu
,
Yeqian Yang
,
Yangyang Yan
,
Maozu Guo
,
Xiangliang Zhang
,
Jun Wang
DeepIDA: Predicting Isoform-Disease Associations by Data Fusion and Deep Neural Networks.
IEEE ACM Trans. Comput. Biol. Bioinform.
19 (4) (2022)
Fengwei Dai
,
David Wei Zhang
,
Yangyang Yan
,
Guojun Wang
,
Liqiang Cao
intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps.
IEICE Electron. Express
19 (2) (2022)
Yangyang Yan
Discussion on International Trade Governance under the Background of Big Data.
ICIMTECH
(2021)
Yangyang Yan
,
Yaping Fan
Influence of Fluid on Seal and Assembly of Pipeline Fittings Based on the Multiscale Finite Element Model.
Complex.
2020 (2020)
Yangyang Yan
,
Ziyue Zhang
,
Zhiqiang Cheng
,
Lingfeng Zhou
,
Zhiming Chen
,
Yingtao Ding
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.
3DIC
(2016)
Yangyang Yan
,
Yingtao Ding
,
Qianwen Chen
,
Kang Wook Lee
,
Takafumi Fukushima
,
Mitsumasa Koyanagi
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.
3DIC
(2015)
Yingtao Ding
,
Yangyang Yan
,
Qianwen Chen
,
Shiwei Wang
,
Rui Su
,
Hua Dang
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner.
Microelectron. Reliab.
54 (6-7) (2014)