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intermetallic compound for 5μm diameter Cu/Ni/Sn-3.0Ag micro bumps.

Fengwei DaiDavid Wei ZhangYangyang YanGuojun WangLiqiang Cao
Published in: IEICE Electron. Express (2022)
Keyphrases
  • electron microscopy
  • low energy
  • x ray
  • thin film
  • data sets
  • pairwise
  • mechanical properties
  • real time
  • neural network
  • information retrieval
  • training data
  • data structure
  • electro mechanical systems